Memory Packaging Market Is Expected to Grow at a CAGR of 4%-6% by 2025 – an Exclusive Market Research Report by Lucintel

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Trends, opportunities and forecast in memory packaging market to 2025 by platform (flip-chip, lead frame, wafer level chip scale packaging, and others), by application (NAND flash packaging, NOR flash packaging, DRAM packaging), by end use industry (IT and telecom, consumer electronics, automotive, and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW)

Lucintel’s latest market report analyzed that memory packaging provides attractive opportunities in the IT and telecom, consumer electronics, embedded systems. The memory packaging market is expected to grow at a CAGR of 4%-6%. In this market, flip-chip is the largest segment by platform, whereas consumer electronics are largest by end use industry.

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Based on platform, the memory packaging market is segmented into flip-chip, lead frame, wafer level chip scale packaging, and others. The flip-chip segment accounted for the largest share of the market in 2020 due to increased adoption in the DRAM PC/server, fueled by high bandwidth requirements.

Browse in-depth TOC on “Memory Packaging Market”

XX – Tables

XX – Figures

150– Pages

The memory packaging market is marked by the presence of several big and small players. Some of the prominent players offering Memory packaging include Lingsen Precision Industries Ltd, Hana Micron Inc, ASE Kaohsiung, Amkor Technology Inc, Powertech Technology Inc.  


This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link

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