Immersion Cooling Market Global Forecast to 2029 | DataMIntelligence

DataM Intelligence
The Global Immersion Cooling Market is expected to grow at a high CAGR of 23.4% during the forecasting period (2022-2029).

Market Overview

The global immersion cooling market is expected to grow at a CAGR of 23.4% from 2022 to 2029.

Immersion cooling is the process of immersing servers, GPUs, ASICs, and other IT hardware such as memory, drives, and CPUs into the non-conductive fluid for cooling the systems.

It is an effective cooling method that provides higher efficiencies. Immersion cooling is useful for reducing cooling costs, eliminating fan and power supply replacement, reducing information technology footprint, increasing density, carbon footprint reduction, minimizing downtime, maximizing reliability, and overclocking to increase performance. Companies that provide immersion cooling services work with various technology sectors and adhere to several norms and regulations. Agriculture, automotive, raw materials, IT and electronics, environmental protection, food testing, and oil and gas industries are a few examples of industries that require testing, inspection and certification services.


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Market Dynamics

The market is driven by the demand for immersion cooling for keeping the computer systems cool as immersion cooling help in cutting the energy consumption and reducing carbon dioxide emissions. Immersion cooling is useful for reducing costs and increasing location flexibility.

The immersion cooling helps improve the thermal design by directly immersing IT hardware in a non-conductive liquid. It is useful for increasing the hardware density and providing higher processor utilization by maintaining temperatures below the thermal limit. It significantly reduces the noise in server rooms. The immersion cooling prevents information technology equipment from environmental contaminants such as dust and sulfur.



ASTDM D2240 and ASTM D471 are two standards utilized in checking the material compatibility for immersion cooling systems. The Standards are explained below:

ASTM D2240: The ASTM D2240 Test or Durometer Hardness Shore Test is used to assess the relative hardness of soft materials, such as plastic or rubber. The penetration of a specific indentor into the material under specified force and time circumstances is measured in this test. The hardness value is frequently used to identify or specify a certain elastomer hardness or as a quality control measure on large batches of material.



Though the COVID-19 pandemic had a detrimental effect on certain aspects of the global immersion cooling market, the pandemic’s overall impact is positive. The two major disruptive impacts of COVID-19 include the following parameters. The first and foremost impact of the pandemic comes from its impact on the supply chain, thereby tarnishing the availability of raw materials and the sales of the finished product. Secondly, the manufacture of immersion cooling systems involves many manufacturing and development processes that were widely hampered due to the lockdowns and government regulations to reduce the workers’ numbers in response to the COVID-19 pandemic.


Market Segmentation

By Product Type

By Application

By Cooling Fluid Type

By Region


Market Segmentation – By Product Type

The single-phase immersion cooling type segment is expected to lead the market during the forecast period. The demand for single-phase immersion cooling will continue to rise as it is cheaper to set up and more energy efficient.

As consumers become more aware of the tradeoffs between single-phase and two-phase immersion, the demand for single immersion cooling will grow.

Single-phase immersion cooling is a simple, efficient, and inexpensive method of cooling electrical components, devices, and sub-systems by fully immersing the device directly into a single-phase dielectric heat transfer fluid that is either passively circulated by the natural convection of the heated coolant or actively circulated by pumping the dielectric coolant in, through and around the electrical device being cooled, and then transferring the heat absorbed by the coolant to a heat rejection device such as a radiator, dry cooler, liquid-to-liquid heat exchanger, or cooling tower.


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Geographical Analysis

Asia-Pacific is expected to be the fastest-growing regional market over the projection period. Businesses across various industries, expected future pandemic-like systemic disruptions, are increasing focus on IT scalability and resilience by deploying hybrid and cloud colocation solutions.

Furthermore, growing technology services firms in Asia- Pacific, such as Platform-as-a-Service (PaaS) and Software-as-a-Service (SaaS), are considering public cloud providers for their service offerings. These factors are projected to increase demand for colocation data centers in the future years, increasing market growth.

In addition, Asia-Pacific is one of the world’s most rapidly developing data center areas. Smart technologies, IoT-powered gadgets, Big Data, Industry 4.0, 5G, and cloud computing have all grown in importance in recent years in the region, resulting in Data Centers (DC) playing a larger role in organizations. The adoption of liquid immersion and direct-to-chip cooling and the implementation of 5G networks are driving the growth of the data center market in the region. Other factors include the procurement of renewable energy, the installation of innovative data center technology, and artificial intelligence enhancing liquid immersion and direct-to-chip cooling adoption are driving the business of data centers in the region.



The global immersion cooling market is highly competitive with presence of global companies. Some of the key players which are contributing to the growth of the market include Fujitsu Limited, Green Revolution Cooling Inc, Submer Technologies, Allied Control Ltd., Asperitas, Midas Green Technologies, Iceotope Technologies Limited, Liquidcool Solutions, Inc., Downunder Geosolutions Pty Ltd and DCX .

The major players are adopting several growth strategies such as product launches, acquisitions, and collaborations, which are contributing to the growth of the market globally.

For instance, in June 2021, Schneider Electric, and Iceotope Technologies Limited together have announced the launch of a liquid-cooled, EcoStruxure Modular Data Center, All-In-One Module. Integrated by Avnet and containing chassis-level precision immersion cooling from Iceotope, the new prefabricated module will allow the most CPU- and GPU-intensive high-performance computing (HPC) edge applications to be deployed with greater reliability in harsh and remote environments.


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