Opportunities in the bonding Film market have evolved through a number of stages i.e. Lucintel has found the future of this market to be promising; the bonding film market is expected to reach $1.6 billion by 2027 with a CAGR of 6%. In this market, thermally cured is expected to remain the largest material technology, and electrical & electronics segment is expected to remain the largest application. Players can benefit from the available opportunities like increasing demand for bonding films from various end use industries, such as electrical & electronics and transportation..
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Arkema, Cytec Solvay Group, Dai Nippon Printing, DuPont, Fastel Adhesives and Substrate Products, Formplast, Gurit, H.B. Fuller, Henkel AG, Hexcel Corporation are some of the companies profiled in this report.
Some of the features of this report:
Market size estimates: Bonding film market size estimation in terms of value ($M) shipment.
Trend and forecast analysis: Market trend (2016-2021) and forecast (2022-2027) by technologies, and end use industry.
Segmentation analysis: Bonding film market size by various segments, such as technology and end use industry in terms of value and volume shipment.
Regional analysis: Bonding film market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
Growth opportunities: Analysis on growth opportunities in different end use industries, technologies, and regions for technology of bonding film in the bonding film market.
Strategic analysis: This includes M&A, new product development, and competitive landscape of bonding film in the bonding film market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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