Lucintel’s latest market report analyzed that advanced IC packaging provides attractive opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The advanced IC packaging market is expected to reach $50.1 billion by 2026 with a CAGR of 8%. In this market, flip-chip is the largest segment by packaging type, whereas consumer and communication is largest by end use industry. The development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and 2.5D/3D provides strategic growth path in this market.
Download Brochure of this report by clicking on https://www.lucintel.com/advanced-ic-packaging-market.aspx
Based on packaging type, the advanced IC packaging market is segmented into flip-chip, fan-in wafer level packaging, embedded-die, fan-out, and 2.5D/3D. The flip-chip segment accounted for the largest share of the market in 2020 due to rise in demand for high speed portable devices and increasing need for high packaging density.
Browse in-depth TOC on “Advanced IC Packaging Market”
41 – Tables
74 – Figures
138 – Pages
The advanced IC packaging market is marked by the presence of several big and small players. Some of the prominent players offering advanced IC packaging include Amkor, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and Samsung.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link firstname.lastname@example.org.
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
Company Name: Lucintel
Contact Person: Brandon Fitzgerald
Email: Send Email
Address:8951 Cypress Waters Blvd., Suite 160
Country: United States