Lucintel’s latest market report analyzed that 3D IC provides attractive opportunities in the consumer electronics, telecommunication, automotive, military & aerospace, medical device, and industrial markets. The 3D IC market is expected to reach $18.1 billion by 2028 with a CAGR of 25.0%. In this market, stacked 3D is the largest segment by product, whereas consumer electronics is largest by end use industry.
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Based on product, the 3D IC market is segmented into stacked 3D and monolithic 3D. The stacked 3D segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to because it is highly demanded in AI, machine learning, and data center products.
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The 3D IC Market is marked by the presence of several big and small players. Some of the prominent players offering 3D IC include United Microelectronics Corporation, Tezzaron Semiconductor, 3M, IBM Corporation, Xilin, Monolithic 3D, Intel Corporation, Toshiba Corp, Amkor Technology, Samsung Electronic.
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